WP2 - nothing much extra to report beyond what Marc presented at
Imperial and I said at the meeting on the 23rd. Richard has given a talk
at the Fermilab Real-Time workshop and we hope to write this up and
submit it as an IEEE paper (and LC note of course). We have a meeting in
Manchester on May 14th to try to sort out the details of the interface
between the LDA board and the DIF as that needs to be fixed soon so
other groups wanting to interface to us can. Ideally we'll also go some
way to figuring out which parts of the system need to be synchronous and
which don't as that has bearing on the overall design. I've been tasked
to make contact with the SID concept.

WP4 - Glue studies will be wrapped up for LCWS and a report written.
Again, the most salient points were presented at the Imperial meeting.
Beyond that we want to start looking at mechanical assembly aspects.
We've had an internal review of the manpower available for this and it's
not all that much. We're not going to be able to do an all-singing,
all-dancing assembly system as we'd like to. Instead we need to focus on
probably on or two key areas. I'm currently thinking along the lines of
getting the ASICs mounted on the PCBs automatically as the wire bonding
looks challenging and glue robots to make accurate, small dots to fix
the wafers. We might be able to look at PCB stitching, but that requires
a large infrastructure that we don't currently have manpower to support.
More on this as we firm up our plans in conjunction with the LLR people.