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The Industrial Exhibition will run from Tuesday to Thursday. Companies will be situated outside the main lecture theater on level 3 of the physics department, and next to the coffee on level 2. Companies attending are; CAEN, Wiener, Southern Scientific
We can surely affirm that today we are one of the World
leaders in the field, and surely the most important Company
in Europe. You will find us at our booth at the Workshop
with our latest and most interesting
products.
CES
Delft Electronics Products BV
Electron Tubes
Hamamatsu Photonics
Hamamatsu Photonics are deeply involved in the design and
supply of radiation hard detectors for all of the LHC
projects, primarily for use in the tracker and calorimeter
experiments. Products being exhibited include double sided
strip detectors, radiation hard avalanche photodiodes, metal
channel and hybrid photomultiplier tubes.
Harris
HyComp, Inc.HyComp has designed and manufactured high precision thin film hybrid circuits and resistor networks since 1969. HyComp has five years experience in adhesive flip chip interconnection for hybrids and MCMs. This includes three contracts from the United States Defense Advanced Research Projects Agency (DARPA) to develop processes and set up a prototype production facility for adhesive flip chip hybrid circuits. Our research has made HyComp an industry leader in chip
based flip chip, i.e. flip chip circuits which use
individual die, rather than requiring wafers. We are
applying this approach to detector arrays and
compacthigh-performance electronics for a range of
applications.
Hytec
IMEC
LeCroy
Lemo
Also on show will be their range of Nuclear, hybrid and
multi-fibre environmental connectors. Further information
about LEMO's range of self-latching connectors may be found
on the company's web site.
Micron Semiconductor Ltd.
Oxford Instruments
SdM
Expertise covers digital, analog and mixed signal circuits, with special emphasis on rad tol / rad hard designs. For HEP projects, SdM proposes a MPC service on a rad
hard bipolar process from HARRIS.
Information will be added on each company as soon as it is received.
Exhibition coordinators
Industrial TalksIndustrial companies are still encouraged to submit abstracts, particularly in the areas of new, state of the art, products and new technology in manufacturing and test. Please submit abstracts as instructed here, and register for the conference as instructed here.
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CAEN S.p.A. is an Electronic Manufacturing
Company, established in 1980 by experts coming from the INFN
(Italian Nuclear Physics National Institute). Since the
foundation, we have designed and produced sophisticated
electronic devices addressed to scientific research and
particularly to High Energy and Nuclear Physics.
Dassault Electronique is a private industrial
company. Its know-how for civil applications and industrial
domains is sold through six areas of excellence: multichip
modules (including TAB technology), ASIC design (including
RadHard circuits), microwave circuits , packaging, antenna
systems, and computer aided design. Its technologies include
monolithic, hybrid and microwave circuits. The group has
also internal SMT & hybrid means for low cost
production, specially suited for potential mass production
of sub-asemblies.
DEP will be present at the conference on
September 23rd and 24th. DEP is the inventor and producer of
the innovative Multi Pixel Hybrid Photo Diodes (HPD's). Both
our HPD's and our Image Intensifiers are very suitable
detectors for High Energy Physics.
Hamamatsu Photonics UK Limited was established in
1988 by its Parent Company, Hamamatsu Photonics KK of Japan.
Since its inception nearly fifty years ago, Hamamatsu has
concentrated on the development, design and manufacture of
opto electronic devices and related products.
Hytec Electronics designs and manufacturers
modular instrumentation to international standards including
CAMAC, VME, VXI, PCI, Bit Bus and CANbus. From individual
modules to the integration of large systems, using our
existing range of over 250 modules, or specifically designed
to meet your requirements, we offer a quick response to data
acquisition and control requirements.
IMEC, the Interuniversity
Micro-Electronics Laboratory, Belgium is offering low cost
ASIC prototype and small volume fabrication in the frame of
EUROPRACTICE. The EUROPRACTICE project is funded by the
European Commission and is aimed at stimulating European
industry to use new technologies in their product
development. ASIC prototype and small volume fabrication is
offered in several technologies, such as submicron CMOS and
radiation hard BiCMOS (DMILL).
LEMO will be exhibiting the RD12 sub-miniature
fibre optic connector on the 23rd, 24th and 25th of
September at the LHC workshop at Imperial College (London).
SdM is an ASIC design and test unit, part of the
Alcatel Telecom group.